Pack­a­ging and inter­con­nec­tion technology

For the deve­lo­p­ment of com­pe­ti­tive pro­ducts such as smart­phones, tech­no­lo­gies for incre­asing inte­gra­tion den­sity and sys­tem inte­gra­tion are a pre­re­qui­site today. The requi­re­ments for prin­ted cir­cuit boards and thus for manu­fac­tu­ring have chan­ged extre­mely in recent years.

The aim of the event is to pro­vide an over­view of the latest deve­lo­p­ments in the field of pack­a­ging. The event is aimed at both deve­lo­pers and users from the fields of laser pack­a­ging, optics, elec­tro­nics and micro­sys­tems technology.

In addi­tion to sel­ec­ted tech­ni­cal pre­sen­ta­ti­ons, you can expect a com­pany tour as well as the oppor­tu­nity for exten­sive networking.

This event takes place in coope­ra­tion with our net­work part­ner ficon­TEC Ser­vice GmbH.

Pro­gram

Active Ali­gnment of Camera and LiDAR Modu­les in 6 Degrees of Free­dom based on Image Qua­lity analysis
Simon Viets
ficon­TEC Ser­vice GmbH, Achim

Vir­tual­Lab Fusion Technology
Stef­fen Trains
Light­Trans Inter­na­tio­nal GmbH, Jena

Next Gene­ra­tion Pho­to­nic Inte­gra­tion and Pack­a­ging Solu­ti­ons with Pho­to­nic Wire Bon­ding (PWB) and Facet-Atta­ched Micro-Opti­cal Elements
Dr. Sebas­tian Skacel
Van­guard Auto­ma­tion GmbH, Karlsruhe

Revo­lu­tio­nary approach in pho­to­nic micro-assembly
Yolanda Stabel
INNOCISE GmbH, Saarbrücken

Opti­cal modu­les for coch­lear implants
Dr. Chris­tian Goßler
Opto­Gen­Tech GmbH, Göttingen

High-pre­cis­ion posi­tio­ning methods for micro-opti­cal com­pon­ents using the exam­ple of µLEDs
Dr. Heiko Brüning
Qube­Dot GmbH, Brunswick

IR micro­scopy assis­ted pas­sive ali­gnment for sub-µm accu­rate joi­ning applications
Chris­toph Mittelstädt
ficon­TEC Ser­vice GmbH, Achim

Sub­se­quent com­pany tour and networking