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UID:0-611@optonet-jena.de
DTSTART;TZID=Europe/Berlin:20221007T110000
DTEND;TZID=Europe/Berlin:20221007T120000
DTSTAMP:20220922T124207Z
URL:https://optonet-jena.de/events/seminar-atomic-diffusion-bonding-of-waf
 ers-using-various-oxide-films/
SUMMARY:Guest Lecture "Atomic Diffusion Bonding of Wafers"
DESCRIPTION:In a presentation of Prof. Takehito Shimatsu - partner and visi
 ting lecturer of Waferbond '22 conference -  latest research on wafer bon
 ding will be discussed.\n\nAtomic diffusion bonding (ADB) of wafers is a p
 romising process to achieve roomtemperature wafer bonding. In standard ADB
 \, thin metal films are fabricated on two flat wafer surfaces using sputte
 r deposition\, followed by bonding of the two films on the wafers in vacuu
 m. Recently we demonstrated ADB of wafers at room temperature using oxide 
 films [1]. No interface corresponding to the original film surface was obs
 erved (Figure 1)\, indicating high performance of bonding using Y2O3 films
 . Incident light can pass through transparent wafers bonded with oxide fil
 ms without reduction in intensity (Figure 2). Moreover\, the bonded films 
 show a good electrical insulation. Any mirror-polished wafer can be bonded
  using oxide films. These properties are useful to produce new optical or 
 electrical devices. We present the technical potential and current status 
 of ADB using oxide films.\n\n[1] T. Shimatsu\, H. Yoshida\, M. Uomoto\, T.
  Saito\, T. Moriwaki\, N. Kato\, Y. Miyamoto\, and\nK. Miyamoto\, Proc. 7t
 h Int. Workshop on LTB-3D\, 2021\, p. 51.\n\n[caption id="attachment_12704
 " align="alignleft" width="286"] Fig.1 Si wafers bonded using Y2O3 (5 nm) 
 film on each side. (As-bonded).[/caption]\n\n[caption id="attachment_12706
 " align="alignleft" width="176"] Fig.2 Quartz glass wafers bonded at room 
 temperature using ZrO2 (2 nm) film on each side[/caption]\n\n&nbsp\;\n\n&n
 bsp\;\n\n&nbsp\;\n\n&nbsp\;\n\n&nbsp\;\n\n&nbsp\;\n\n&nbsp\;\n\n&nbsp\;\n\
 n\n\nLecturer Prof. Shimatsu-san is leading scientist in the field of wafe
 r bonding at the Frontier Research Institute for Interdisciplinary Science
 s at Tohoku University of Japan. Prof. Shimatsu is engaged in various orga
 nizations like the Japan Institute of Electronics Packaging\, IEEE\, the M
 agnetics Society\, the Magnetics Society of Japan and the Japan Institute 
 of Metals and Materials.\n\n&nbsp\;\n\nAttending the lecture is free of ch
 arge\, industry partners\, scientists and engineers of the photonics regio
 n of Jena are kindly invited.
CATEGORIES:Workshop
LOCATION:Ernst-Abbe-Hochschule Jena | Haus 5 | HS 5\, Carl-Zeiss-Promenade 
 2\, Jena\, 07745\, Deutschland
GEO:50.91829;11.56868
X-APPLE-STRUCTURED-LOCATION;VALUE=URI;X-ADDRESS=Carl-Zeiss-Promenade 2\, Je
 na\, 07745\, Deutschland;X-APPLE-RADIUS=100;X-TITLE=Ernst-Abbe-Hochschule 
 Jena | Haus 5 | HS 5:geo:50.91829,11.56868
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DTSTART:20220327T030000
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TZOFFSETTO:+0200
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